Last year AMD introduced the Zen 2 microarchitecture, the company’s second major iteration of its Zen design. Zen 2 brought significant architectural changes at both the core level and the full SoC level. Undoubtedly, a big part of this success can be directly attributed to the company’s decision to dive headfirst into TSMC’s leading-edge 7-nanometer node. The move to TSMC 7-nanometer is a pretty big aggressive move, not only because it’s such a large technology shift, but also because of the new physical challenges it brings along with it – challenges that required the entire ecosystem – such as the foundry and CAD and EDA vendors – to collaborate on resolving those issues. At the recent ISSCC 2020 conference, AMD delved into some of those challenges in a little more detail.